Decapsulation
Using chemical or mechanical methods, we expose the interior of components to verify their originality and detect any defects. It’s a destructive but highly definitive method, particularly for complex semiconductor components.
Many semiconductor components undergo a meticulous decapsulation process using a chemical etching technique, where the semiconductor chip (die) is gently exposed. A specific combination of concentrated acids and heat, tailored to the package type, is used. Following a thorough clean and dry, the die is inspected via the created opening using high-resolution digital microscopy.
Our specialists focus on verifying the correct die marking and manufacturer logo, conducting a detailed comparison of the microchip's architecture against a reference sample. This allows for the reliable detection of counterfeit components, defective dies, and/or faulty bond connections.
Other components, like relays, IGBT modules, or semiconductors on a metal or ceramic package, may be opened using various mechanical methods.
Opening a component chemically or mechanically is a destructive test, which means that the component is lost. However, the accuracy and reliability of the authenticity determination is significantly higher compared to an X-ray inspection.
