Material Analysis (XRF)
This covers analyzing the material composition of solder surfaces and coatings to confirm RoHS compliance and ensuring the exclusion of lead-containing solder.
The X-ray fluorescence analysis (XRF) is a non-destructive method for determining the elemental composition of a material sample.
This analysis precisely determines the proportions of individual elements, enabling the detection of impermissible substances and the verification of specified material compositions.
For semiconductor component testing, the device package materials and leads are specifically tested for substance concentrations not permitted under the EU’s RoHS Directive.
For component leads in particular, this concerns the elements lead, cadmium, mercury and hexavalent chromium, among others. Violations of the RoHS directives can lead to severe fines, as the distributor in the EU is liable for all subsequent damages.
The XRF of contact elements also serves to match the structural components with data sheet specifications and/or values of a reference component during authenticity checks. Here, lead can indicate counterfeiting if previous lead-containing coatings were not fully removed or if lead-containing solder was used in re-tinning because it is easier to process.
