X-ray Inspection
The non-destructive testing of components and entire assemblies. Detection of empty components or different internal structures, faulty bonds, and material defects.
X-ray inspection can assess the die construction of components unsuitable for chemical or mechanical decapsulation due to their design or the need for preservation.
The method excels in depicting geometric details with high precision, especially through 3D X-ray imaging (CT). Defects such as entirely empty components, deviating die or lead frame layouts, faulty bonds, delamination, and other anomalies are readily detected.
Due to the limited resolution and low contrast of filigree semiconductor structures, it is usually not possible to accurately image the actual die topography. This particularly applies to comparing the die marking and manufacturer’s logo. These crucial details for authenticity checks can only be visualized using high-resolution digital microscopy after a component decapsulation (decap).
